Multipactor Suppression via Additive Manufacturing

Author:

Langellotti Stephen V.1ORCID,Brusstar Adam1ORCID,Jordan Nicholas M.1ORCID,Lau Y. Y.1ORCID,Gilgenbach Ronald M.1ORCID

Affiliation:

1. Department of Nuclear Engineering and Radiological Sciences, University of Michigan, Ann Arbor, MI, USA

Funder

Air Force Office of Science Research Multi-University Research Initiative (AFOSR MURI) through Michigan State University

Directed Energy Professional Society graduate student scholarship

College of Engineering, Michigan State University

Michigan Center for Materials Characterization

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Reference36 articles.

1. Influence of air exposures and thermal treatments on the secondary electron yield of copper

2. A User's Guide to Vacuum Technology

3. Evaluation of multipactor thresholds for coaxial lines subject to surface conditioning for the WEST ion cyclotron antenna;sleiman;Fusion Eng Design,2022

4. Ping-pong modes and higher-periodicity multipactor;kishek;Phys Plasmas,2013

5. Suppression of high-power microwave dielectric multipactor by resonant magnetic field

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