Affiliation:
1. Center for Pulsed Power and Power Electronics, Texas Tech University , Lubbock, Texas 79409, USA
Abstract
This study investigates multipactor mitigation techniques in X-band geometries, focusing on surface modifications, surface conditioning, and additive manufacturing. Surface modifications include geometric alterations such as dimpled surfaces. Experimental results demonstrate that 3D-printed copper test pieces can achieve a multipactor onset threshold comparable to traditionally machined test pieces with appropriate sample preparation. Surface conditioning, involving rapid successions of pulses, is explored for its mitigative potential. Among assessed techniques, dimpled configurations demonstrated superior multipactor hold-off compared to non-modified components. Additionally, the conditioning of test pieces significantly increased the single-pulse threshold.
Funder
Air Force Office of Scientific Research
Reference29 articles.
1. Multipactor;IEEE Trans. Electron Devices,1988
2. On the limits of multipactor in rectangular waveguides;Phys. Plasmas,2020
3. Multipactor experiment on a dielectric surface;Rev. Sci. Instrum.,2001
4. Multipacting modes of high-frequency gaseous breakdown;Phys. Rev.,1958
5. Two surface multi-pactor with non-sinusoidal RF fields and space charge effects,2023