Nanosized-Metal-Grain-Pattern-Dependent Threshold-Voltage Models for the Vertically Stacked Multichannel Gate-All-Around Si Nanosheet MOSFETs and Their Applications in Circuit Simulation
Author:
Affiliation:
1. Department of Electronics and Electrical Engineering, Parallel and Scientific Computing Laboratory, Institute of Communications Engineering, National Yang Ming Chiao Tung University, Hsinchu, Taiwan
Funder
National Science and Technology Council (NSTC), Taiwan
“2022 Qualcomm Taiwan Research Program, National Yang Ming Chiao Tung University (NYCU),”
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx7/16/10382412/10310111.pdf?arnumber=10310111
Reference43 articles.
1. Celebrating 75 years of the transistor A look at the evolution of Moore’s Law innovation
2. Stacked nanosheet gate-all-around transistor to enable scaling beyond FinFET
3. A Comprehensive Study of Nanosheet and Forksheet SRAM for Beyond N5 Node
4. Investigations on Line-Edge Roughness (LER) and Line-Width Roughness (LWR) in Nanoscale CMOS Technology: Part I–Modeling and Simulation Method
5. Investigations on Line-Edge Roughness (LER) and Line-Width Roughness (LWR) in Nanoscale CMOS Technology: Part II–Experimental Results and Impacts on Device Variability
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1. Benchmarking of Multi-Bridge-Channel FETs Toward Analog and Mixed-Mode Circuit Applications;IEEE Access;2024
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