Process and Tool Monitoring Strategy for Advanced Magnetic Tunnel Junction Stack Deposition-Reference-Cited by-同舟云学术

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Process and Tool Monitoring Strategy for Advanced Magnetic Tunnel Junction Stack Deposition

Published:2024-05-13 Issue: Volume: Page:1-3
ISSN:
Container-title:2024 35th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Rodriguez Gabriel¹,Van Der Straten Oscar¹,Mehta Virat¹,Slaughter J. M.¹,Kaiser Christian¹,Huang Chien-Fu¹,Frye Dan¹,Carr Ryan¹

Affiliation:

1. IBM Research, IBM,Albany,United States

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10545359/10545360/10545528.pdf?arnumber=10545528

Reference6 articles.

1. Spin-Transfer-Torque MRAM: the Next Revolution in Memory

2. Method for improving stability of plasma ignition in a multi-cathode magnetron PVD system

3. Magnetoresistance measurement of unpatterned magnetic tunnel junction wafers by current-in-plane tunneling

4. Optimization of perpendicular anisotropy of Ta-inserted double CoFeB/MgO interface MTJ’s for STT-MRAM

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