Effects of Process Parameters and Isothermal Fatigue Cycling on Electromechanical Properties of Screen-printed Interconnect on Nonwovens for Wearable Electronics
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159379.pdf?arnumber=9159379
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. The Performance and Reliability of Screen-printed Flexible Multilayer Leads for Wearable Vital Sign Monitoring Devices;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics;Journal of Electronic Packaging;2023-02-01
3. The Effect of Thermal Stress on the Reliability of all-Printed Vias on Flexible Substrates;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Current Carrying Capacity of Inkjet-Printed Nano-Silver Interconnects on Mesoporous PET Substrate;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Fatigue behaviour of inkjet-printed silver interconnects on silica-coated mesoporous flexible PET substrate;Flexible and Printed Electronics;2022-03-01
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