Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates-Reference-Cited by-同舟云学术

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Heterogeneous Integration of 5G and Millimeter-Wave Diplexers with 3D Glass Substrates

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Ali Muhammad,Watanabe Atom,Kakutani Takenori,Raj Pulugurtha M.,Tummala Rao. R.,Swaminathan Madhavan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159231.pdf?arnumber=9159231

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Additive Manufacturing of Millimeter Wave Passive Circuits on Thin Alumina Substrates;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

2. The Co-Design of Broadband Diplexer and Quasi-Reflectionless Lowpass/Highpass TFIPD Filter Chip;IEEE Transactions on Circuits and Systems II: Express Briefs;2023-02

3. Design and Characterization of Bandpass Filter with Multiple Zeros on Glass Interposer for 6G Applications;2023 IEEE Radio and Wireless Symposium (RWS);2023-01-22

4. Heterogeneous Integration at Scale;Advances in Semiconductor Technologies;2022-09-30

5. Rediscovery of Glass Materials for Millimeter-wave Wireless Communications;2022 14th Global Symposium on Millimeter-Waves & Terahertz (GSMM);2022-05-18

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