Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer Level Packaging Applications-Reference-Cited by-同舟云学术

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Low Warpage Liquid Compression Molding (LCM) Material for High Density Fan-out and Wafer Level Packaging Applications

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Chao Jay,Zhang Rong,Do Tu,Tong AnhBinh,Ma Yijia,Grimes David,Trichur Ramachandran K.,Bao Lirong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159515.pdf?arnumber=9159515

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reduced warpage in semiconductor packages: Optimizing post-cure temperature profile considering cure shrinkage and viscoelasticity of epoxy molding compound;Materials & Design;2024-09

2. A Study on the Advanced Chip to Wafer Stack for Better Thermal Dissipation of High Bandwidth Memory;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Laser Direct Structuring of Semiconductor Liquid Encapsulants for Active Mold Packaging;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Manufacturing for Reliability of Panel-Level Fan-out Packages;Reliability of Organic Compounds in Microelectronics and Optoelectronics;2022

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