Author:
Meier Karsten,Ochmann Maximilian,Bock Karlheinz,Leslie David,Dasgupta Abhijit
Cited by
10 articles.
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1. A machine learning and finite element simulation-based void inspection for higher solder joint reliability;Microelectronics Reliability;2024-03
2. Improving the Vibration Reliability of SAC Flip-Chip Interconnects Using Underfill;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17
3. Effect of temperature on vibration durability of lead-free solder joints;Microelectronics Reliability;2022-12
4. Copper Trace Failures in Ball Grid Array (BGA) Packages under Sequential Harmonic Vibration and Temperature Cycling;2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm);2022-05-31
5. Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling;2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2022-04-25