Author:
Kim JungHwa,Lee Heeseok,Hwang Jisoo,Yoo Jongkyu
Cited by
7 articles.
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1. TSV-based Stacked Silicon Capacitor with Embedded Package Platform;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Modeling High-Frequency and DC Path of Embedded Discrete Capacitor Connected by Double-Side Terminals with Multi-layered Organic Substrate and RDL-based Fan-out Package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Low ESL Multi-terminal Capacitor Modeling;2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2021-12-21
4. Mechanical Robustness Study of Ultra Low Profile 3D Silicon Capacitors;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07
5. Multi-Terminal Low-ESL 3D Silicon Capacitors as Enabler for Optimized and Flat PDN Design;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06