New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design-Reference-Cited by-同舟云学术

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New simultaneous switching noise analysis and modeling for high-speed and high-density CMOS IC package design

Published:2000-05 Issue:2 Volume:23 Page:303-312
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Yungseon Eo ,Eisenstadt W.R.,Ju Young Jeong ,Oh-Kyong Kwon

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/18369/00846649.pdf?arnumber=846649

Cited by 16 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Analysis of Simultaneous Switching Noise and IR-Drop in Side-Contact Multilayer Graphene Nanoribbon Power Distribution Network;Journal of Circuits, Systems and Computers;2017-08-23

2. Design and analysis of high-speed split-segmented switched-capacitor DACs;Analog Integrated Circuits and Signal Processing;2017-04-26

3. Signal-Integrity Optimization for Complicated Multiple-Input Multiple-Output Networks Based on Data Mining of S-Parameters;IEEE Transactions on Components, Packaging and Manufacturing Technology;2014-07

4. Improvement of simultaneous switching noise simulation considering on-chip capacitance;2010 IEEE International Symposium on Electromagnetic Compatibility;2010-07

5. Dynamic Supply Current Waveform Estimation with Standard Library Information;IEICE Transactions on Fundamentals of Electronics, Communications and Computer Sciences;2010

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