Analysis of Simultaneous Switching Noise and IR-Drop in Side-Contact Multilayer Graphene Nanoribbon Power Distribution Network

Author:

Bhattacharya Sandip1ORCID,Das Debaprasad2,Rahaman Hafizur1

Affiliation:

1. School of VLSI Technology, Indian Institute of Engineering Science and Technology, Shibpur, Howrah 711103, West Bengal, India

2. Department of Electronics and Communication Engineering, Assam University, Silchar 788011, Assam, India

Abstract

The work in this paper presents the analyses of temperature-dependent simultaneous switching noise (SSN) and IR-Drop in multilayer graphene nanoribbon (MLGNR) power interconnects for 16[Formula: see text]nm ITRS technology node. A [Formula: see text] standard cell-based integrated circuit is designed to analyze the SSN and IR-Drop using the proposed temperature-dependent model of MLGNR and Cu interconnect for 10[Formula: see text][Formula: see text]m interconnect length at temperatures (233[Formula: see text]K, 300[Formula: see text]K and 378[Formula: see text]K). Our analysis shows that MLGNR exhibits ([Formula: see text]–[Formula: see text]) less SSN and ([Formula: see text]–[Formula: see text]) less IR-Drop as compared with traditional Cu-based power interconnects. Our analysis also shows that the average percentage of reduction in peak SSN is 52–32% (at 233[Formula: see text]K), 53–32% (at 300[Formula: see text]K) and 52–30% (at 378[Formula: see text]K) less in MLGNR compared with traditional Cu-based power interconnect and the average percentage of reduction in peak IR-Drop in MLGNR is 54–31% (at 233[Formula: see text]K), 57–29% (at 300[Formula: see text]K) and 57–26% (at 378[Formula: see text]K) less than that of Cu-based power interconnects.

Publisher

World Scientific Pub Co Pte Lt

Subject

Electrical and Electronic Engineering,Hardware and Architecture,Electrical and Electronic Engineering,Hardware and Architecture

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