Spectroscopic measurement of mounting-induced strain in optoelectronic devices-Reference-Cited by-同舟云学术

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Spectroscopic measurement of mounting-induced strain in optoelectronic devices

Published:2000-05 Issue:2 Volume:23 Page:170-175
ISSN:1521-3323
Container-title:IEEE Transactions on Advanced Packaging
language:
Short-container-title:IEEE Trans. Adv. Packag.

Author:

Barwolff A.¹,Tomm J.W.,Muller R.,Weiss S.,Hutter M.,Oppermann H.,Reichl H.

Affiliation:

1. Max-Born-Inst. fur Nichtlineare Opt. und Kurzzeitspektroskopie, Berlin, Germany

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/6040/18369/00846629.pdf?arnumber=846629

Cited by 14 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Study on Packaging-Induced Stress in 4 mm Cavity Length High-Power Single Emitter Semiconductor Laser;SPECTROSC SPECT ANAL;2014

2. Investigations of transient thermal properties of conductively cooled diode laser arrays operating under quasicontinuous-wave conditions;Microelectronics Reliability;2006-12

3. Measurement systems for the investigation of soldering quality in high-power diode laser bars;Journal of Lightwave Technology;2005-11

4. Flip Chip Reliability of GaAs on Si Thinfilm Substrates Using AuSn Solder Bumps;MRS Proceedings;2005

5. Flip-chip assembly and reliability using gold/tin solder bumps;SPIE Proceedings;2004-09-08

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