Gas-assisted evaporative cooling of high density electronic modules-Reference-Cited by-同舟云学术

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Gas-assisted evaporative cooling of high density electronic modules

Published:1995 Issue:3 Volume:18 Page:502-509
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Bar-Cohen A.,Sherwood G.,Hodes M.,Solbreken G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/9755/00465144.pdf?arnumber=465144

Cited by 42 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

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