Author:
Mak T.W.C.,Feinstein L.G.
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Cited by
4 articles.
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1. Plastic encapsulated components for cars;IEEE Instrumentation & Measurement Magazine;2001-06
2. FEM and BEM in electronic packaging A bibliography (1998–1999);Finite Elements in Analysis and Design;2001-02
3. High resolution thermal simulation of electronic components;Microelectronics Reliability;2000-12
4. Thermal investigation of plastic-encapsulated and hermetically sealed components for automotive industry;24th International Spring Seminar on Electronics Technology. Concurrent Engineering in Electronic Packaging. ISSE 2001. Conference Proceedings (Cat. No.01EX492)