1. An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures;Haque;IEEE Trans Adv Packag,1999
2. Basic features, construction, and physical properties of IGB-transistors and their application in railroad transportation systems;Fasching;e&i,1996
3. Honea EC, Beach RJ, Mitchell SC, Avizonis PV. 183 W, m2=2.4 Yb:YAG q-switched laser. In: Proceedings of the Conference on Lasers and Electro-Optics '99/Quantum Electronics and Laser Science Conference '99, Baltimore, MD, 1999. p. 1–3
4. Comparison of the thermal characteristics of plastic and ceramic packages for medical applications;Nicolics;Trans Precis Electron Technol,1997
5. A step forward in the transient thermal characterization of chips and packages;Szeleky;J Microelectron Reliab,1999