Author:
Rogie Brice,Codecasa Lorenzo,Monier-Vinard Eric,Bissuel Valentin,Laraqi Najib,Daniel Olivier,D'Amore Dario,Magnani Alessandro,d'Alessandro Vincenzo,Rinaldi Niccolo
Cited by
11 articles.
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1. Boundary Condition Independent Compact Thermal Models Enhanced by Contour Elements;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Structure Curve Representation of Dynamic Thermal Multi-Ports;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
3. Model Order Reductiono of a nonlinear model of an electronic component: Application to a microchip activated by four sources;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30
4. Structure-Preserving Model Order Reduction for Thermal Analysis;2023 International Symposium of Electronics Design Automation (ISEDA);2023-05-08
5. Multi-Objective Evolutionary Optimization of Multi-node Network for Thermal Modelling of Electronic Package;2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2022-09-28