In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features-Reference-Cited by-同舟云学术

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In-situ measurement of various thin bond-line-thickness thermal interface materials with correlation to structural features

Published:2008-09 Issue: Volume: Page:
ISSN:
Container-title:2008 14th International Workshop on Thermal Inveatigation of ICs and Systems
language:
Short-container-title:

Author:

Wunderle B.¹,Kleff J.¹,Mrossko R.²,Abo Ras M.¹,May D.¹,Schacht R.¹,Oppermann H.¹,Keller J.²,Michel B.¹

Affiliation:

1. Fraunhofer Institute Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355 Berlin, Germany

2. Berliner Nanotest und Design GmbH, D-12489 Berlin, Germany

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4663477/4669861/04669890.pdf?arnumber=4669890

Cited by 4 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 加圧下におけるアルミ/熱伝導性グリス/銅の断面観察;Journal of Smart Processing;2023-11-10

2. Performance evaluation of carbon nanoparticle-based thermal interface materials;Diamond and Related Materials;2020-10

3. Advanced packaging methods for high-power LED modules;Journal of Solid State Lighting;2015-06-06

4. Compact thermal modeling of hot spots in advanced 3D-stacked ICs;2009 11th Electronics Packaging Technology Conference;2009-12

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