Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application-Reference-Cited by-同舟云学术

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Nano Ni/Cu-TSVs with an Improved Reliability for 3D-IC Integration Application

Published:2020-08 Issue: Volume: Page:
ISSN:
Container-title:2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
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Author:

Murugesan M.,Mori K.,Kojima T.,Hashimoto H.,Bea J.C.,Fukushima T.,Koyanagi M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9180248/9185190/09185397.pdf?arnumber=9185397

Cited by 7 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Technology for Manufacturing TSV Structures for the Creation of Silicon Interposers Using Temporary-Bonding Technology;Nanobiotechnology Reports;2024-04

2. Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2023-12

3. A stress evaluation approach for the silicon with nano-TSVs by Raman spectroscopy;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. Fabrication and Characterization of Thin Metal Films Deposited by Electroless Plating with Organic Additives for Electrical Circuits Applications;Micromachines;2023-05-29

5. A Review on the Fabrication and Reliability of Three-Dimensional Integration Technologies for Microelectronic Packaging: Through-Si-via and Solder Bumping Process;Metals;2021-10-19

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