Ultraprecise Printing of D-Band Transmission Lines
Author:
Affiliation:
1. Institute for Large Area Microelectronics (IGM), University of Stuttgart, Stuttgart, Germany
2. Institute of Radio Frequency Engineering and Electronics (IHE), Karlsruhe Institute of Technology, Karlsruhe, Germany
Funder
Ministry of Science, Research, and the Arts of the State of Baden-Wuerttemberg, Germany, within the framework of the “Mobility of the Future” Innovation Campus
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Link
http://xplorestaging.ieee.org/ielx7/9944983/10273759/10214495.pdf?arnumber=10214495
Reference11 articles.
1. Printing of Micrometer-Size Features on Complex Substrates for System Integration
2. Ultra‐Thin Chips with Printed Interconnects on Flexible Foils
3. CAD models for shielded multilayered CPW
4. E-band characterization of 3D-printed dielectrics for fully-printed millimeter-wave wireless system packaging
5. Aerosol Jet Printed Millimeter Wave Interconnects in D-Band
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