Effect of Ge doping on electrochemical migration of SAC alloys in 0.5 M NaCl solution-Reference-Cited by-同舟云学术

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Effect of Ge doping on electrochemical migration of SAC alloys in 0.5 M NaCl solution

Published:2021-10-27 Issue: Volume: Page:
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Container-title:2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME)
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Author:

Gharaibeh Ali,Medgyes Balint

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9663569/9663417/09663682.pdf?arnumber=9663682

Reference24 articles.

1. Effects of Ag and Cu Additions on the Electrochemical Migration Susceptibility of Pb-free Solders in Na2SO4 Solution;yoo;Corrosion Science and Technology,2007

2. Evidence for Ag participating the electrochemical migration of 96.5Sn-3Ag-0.5Cu alloy

3. Electrochemical migration behavior of Sn–3.0Ag–0.5Cu solder alloy under SO2 polluted thin electrolyte layers

4. Investigation of corrosion on SAC 305, SAC 0307 and SAC 0307-0.03 P-0.005 Ni solder paste alloys in simulated body fluid (SBF)

5. Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO3 solution

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrochemical migration investigation on SAC alloys incorporated by TiO₂ nanoparticles in NaCl solution;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13

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