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Investigation of electrochemical migration on Sn-0.7Cu-0.3Ag-0.03P-0.005Ni solder alloy in HNO3 solution

  • Published:2015 Issue: Volume: Page:
  • ISSN:0094-243X
  • Container-title:AIP Conference Proceedings
  • language:
  • Short-container-title:

Author:

Sarveswaran C.,Othman N. K.,Ali M. Yusuf Tura,Ani F. Che,Samsudin Z.

Publisher

AIP Publishing LLC

Reference13 articles.

1. E. McCafferty, Introduction to Corrosion Science(Springer, London, 2010), p. 13.

2. M.G. Fontana, Corrosion Engineering, third edition (McGraw-Hill, New York, 1987), p. 2.

3. B. Medgyes, B. Illes and, G. Harsanyi, ElectrEng and Comput Sci. 57, 49–55 (2013).

4. Lead-free Solders in Microelectronics

5. R. Deshmukh and A. More, Int J of Civil and StructEng Res. 2, 58–65 (2014).

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2. The Fractal Characteristics of Electrodeposition and Electrochemical Migration Dendrites;Moscow University Physics Bulletin;2022-10

3. Electrochemical Migration Investigation on Lead-Free Sn-based Solder Alloys in 3.5 wt.% NaCl Solution;2022 45th International Spring Seminar on Electronics Technology (ISSE);2022-05-11

4. Effect of Ge doping on electrochemical migration of SAC alloys in 0.5 M NaCl solution;2021 IEEE 27th International Symposium for Design and Technology in Electronic Packaging (SIITME);2021-10-27

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