Wafer-level electromigration tests on NIST and SWEAT structures-Reference-Cited by-同舟云学术

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Wafer-level electromigration tests on NIST and SWEAT structures

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Container-title:Proceedings International Conference on Microelectronic Test Structures
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Author:

Giroux F.,Gounelle C.,Mortini P.,Ghibaudo G.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx3/3902/11331/00513978.pdf?arnumber=513978

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Coupling model of electromigration and experimental verification – Part I: Effect of atomic concentration gradient;Journal of the Mechanics and Physics of Solids;2023-05

2. Coupling model of electromigration and experimental verification – Part II: Impact of thermomigration;Journal of the Mechanics and Physics of Solids;2023-05

3. Effect of Thermomigration on Electromigration in SWEAT Structures;2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2023-04-17

4. Graphene Interconnect Lifetime: A Reliability Analysis;IEEE Electron Device Letters;2012-11

5. Electromigration in ULSI interconnects;Materials Science and Engineering: R: Reports;2007-10

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