Si Bridge With Chessboard Patterned Interconnect (CPI): Enabling High Density, High Efficiency Heterogeneous Integration
Author:
Affiliation:
1. College of Information and Communication Engineering, Sungkyunkwan University,Korea
Funder
National Research Foundation of Korea (NRF)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10457047/10457087/10457114.pdf?arnumber=10457114
Reference5 articles.
1. Embedded Multidie Interconnect Bridge—A Localized, High-Density Multichip Packaging Interconnect
2. Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration
3. Modeling and analysis of a trace referenced to a meshed ground plane
4. Electrical Transmission Properties of HBM Interface on 2.1-D System in Package Using Organic Interposer
5. High Bandwidth Low Power 2.5D Interconnect Modeling and Design
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