Electrical Performance Limits of Fine Pitch Interconnects for Heterogeneous Integration

Author:

Durgun Ahmet C.,Qian Zhiguo,Aygun Kemal,Mahajan Ravi,Hoang Tim Tri,Shumarayev Sergey Yuryevich

Publisher

IEEE

Cited by 9 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Floorplanning for Embedded Multi-Die Interconnect Bridge Packages;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

2. Panel-Based Large-Scale RDL Interposer Fabricated Using 2-μm-Pitch Semi-Additive Process for Chiplet-Based Integration;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. A True Full-Duplex IO (TFD-IO) With Background SI Cancellation for High-Density Interfaces;IEEE Transactions on Very Large Scale Integration (VLSI) Systems;2022-05

4. A Fast-Lock All-Digital Clock Generator for Energy Efficient Chiplet-Based Systems;IEEE Access;2022

5. Case studies of accurate fault localization in advanced packages;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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