Interconnect in the Era of 3DIC-Reference-Cited by-同舟云学术

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Interconnect in the Era of 3DIC

Published:2022-04 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE Custom Integrated Circuits Conference (CICC)
language:
Short-container-title:

Author:

Li Shenggao¹,Lin Mu-Shan¹,Chen Wei-Chih¹,Tsai Chien-Chun¹

Affiliation:

1. Cheng-Hsiang Hsieh TSMC Inc.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9772767/9772730/09772820.pdf?arnumber=9772820

Reference23 articles.

1. Graphene Transistors: Status, Prospects, and Problems

2. International Roadmap For Devices And Systems;Lithography,2020

3. Architecting an Energy-Efficient DRAM System for GPUs;chatterjee;IEEE International Symposium on High-Performance Comp Architecture,0

4. Designing vertical processors in monolithic 3D

5. Foundry Solutions for 2.5D/3D Intergration;yu;ISSCC,2021

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. System-level Innovation for the Next Decade AI Performance, Power, Area with Co-optimization;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09

2. A Scalable Die-to-Die Interconnect with Replay and Repair Schemes for 2.5D/3D Integration;2023 IEEE International Symposium on Circuits and Systems (ISCAS);2023-05-21

3. Silicon Process Technology Constraints for Standardized Vertical Die-to-Die Interconnects;2023 IEEE Custom Integrated Circuits Conference (CICC);2023-04

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