1. Reliability Meta-modelling of Power Components;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
2. Physics-informed Machine Learning for Predicting Fatigue Damage of Wire Bonds in Power Electronic Modules;2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE);2024-04-07
3. Extended Analysis of Power Cycling Behavior of TO-Packaged SiC Power MOSFETs;2023 IEEE International Reliability Physics Symposium (IRPS);2023-03
4. Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2020-06
5. Design and Experimental Validation of a Wire-Bond-Less 10-kV SiC MOSFET Power Module;IEEE Journal of Emerging and Selected Topics in Power Electronics;2020-03