Characterization of Nanoparticles of Lead Free Solder Alloys
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/4060679/4060680/04060695.pdf?arnumber=4060695
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. A study of micro-scale solder bump geometric shapes using minimizing energy approach for different solder materials;Ain Shams Engineering Journal;2022-11
2. Nanopackaging: Nanotechnologies and Electronics Packaging;Nanopackaging;2018
3. Low melting point nanocrystalline Sn–Ag solder synthesized by a refined chemical reduction method;Chinese Science Bulletin;2014-06-26
4. Development and Characterization of Nano-Composite Solder;Lead-Free Solders: Materials Reliability for Electronics;2012-03-15
5. Nanotechnology;Electrical Conductive Adhesives with Nanotechnologies;2009-08-14
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