Application of the TLM method to transient thermal simulation of microwave power transistors
Author:
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials
Link
http://xplorestaging.ieee.org/ielx3/16/8515/00372064.pdf?arnumber=372064
Cited by 15 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Thermal Analysis of Micro-Heaters using the 3D-TLM method and COMSOL Multiphysics software for MEMS based Gas Sensor;PRZEGLĄD ELEKTROTECHNICZNY;2023-03-10
2. Two-Dimensional Thermal Diffusion Equation Solver Based on Unstructured Transmission-Line Modelling and Optimal Delaunay Triangular Meshes;IEEE Journal on Multiscale and Multiphysics Computational Techniques;2022
3. Efficient 3D-TLM Modeling and Simulation for the Thermal Management of Microwave AlGaN/GaN HEMT Used in High Power Amplifiers SSPA;Journal of Low Power Electronics and Applications;2018-06-23
4. TLM method for thermal investigation of IGBT modules in PWM mode;Microelectronic Engineering;2009-10
5. Thermal Transient Response of GaAs FETs Under Intentional Electromagnetic Interference (IEMI);IEEE Transactions on Electromagnetic Compatibility;2008-05
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