Author:
Sakai Taiji,Imaizumi Nobuhiro,Sakuyama Seiki
Cited by
9 articles.
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1. Fly Cutting for Polymer Planarization in Hybrid Cu Bonding;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
2. A Novel Polymer-Based Ultra-High Density Bonding Interconnection;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Recent Advances and Trends in Cu–Cu Hybrid Bonding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
4. Development of Polyimide Base Photosensitive Permanent Bonding Adhesive for Middle to Low Temperature Hybrid Bonding Processes;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. A hybrid bonding interconnection with a novel low-temperature bonding polymer system;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05