Optimizing laser soldering of SMD components: From theory to practice
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx5/6093617/6102636/06102685.pdf?arnumber=6102685
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Laser Soldering of Nickel Plated Steel Sheets;2023
2. A study about 3D stacking of passive SMD elements for advanced SMT packaging using laser assisted bonding;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
3. Vapor-phase reflow soldering ovens;Reflow Soldering;2020
4. A Review on Mechanical Properties of SnAgCu/Cu Joint Using Laser Soldering;The Advances in Joining Technology;2018-05-23
5. Optimization on laser soldering parameters onto lead-free solder joint;IOP Conference Series: Materials Science and Engineering;2017-09
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