1. Hwang JS (2012) Solder paste in electronics packaging: technology and applications in surface mount, hybrid circuits, and component assembly. Springer, Netherlands
2. Silvera J (2012) Soldering made simple: easy techniques for the kitchen-table jeweler. Kalmbach Publishing Company, Books Division, Waukesha
3. Rao (2011) Manufacturing technology: foundry, forming and welding,2e. McGraw-Hill, New York
4. Frear DR, Burchett SN, Morgan HS, Lau JH (1994) Mechanics of solder alloy interconnects. Springer, US
5. Gnecco F, Ricci E, Amore S, Giuranno D, Borzone G, Zanicchi G, Novakovic R (2007) Wetting behaviour and reactivity of lead free Au–In–Sn and Bi–In–Sn alloys on copper substrates. Int J Adhes Adhes 27(5):409–416