Advanced substrate and packaging concepts for compact system integration with additive manufacturing technologies for high temperature applications
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7348933/7357338/07357402.pdf?arnumber=7357402
Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
2. Fabrication of metal-ceramic substrates by laser powder bed fusion using a high-power green laser and high temperature preheating;Laser 3D Manufacturing XI;2024-03-12
3. Vision on metal additive manufacturing: Developments, challenges and future trends;CIRP Journal of Manufacturing Science and Technology;2023-12
4. Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11
5. Printing of Micrometer-Size Features on Complex Substrates for System Integration;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
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