Additive Metallization of Alumina with Copper-Titanium Powder Blends for Power Electronic Applications
Author:
Affiliation:
1. Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen-Nürnberg,Nuremberg,Germany
2. TUM School of Engineering and Design,Professorship of Laser-based Additive Manufacturing,Munich,Germany
Funder
Deutsche Forschungsgemeinschaft (DFG, German Research Foundation)
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10418252/10418244/10418396.pdf?arnumber=10418396
Reference19 articles.
1. The Direct Bonding of Metals to Ceramics by the Gas‐Metal Eutectic Method
2. Interface Structure and Bond Strength of Copper-Bonded Alumina Substrates;YOSHINO;Journal of the American Ceramic Society,1991
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1. Laser powder bed fusion of titanium alloyed copper powder for power electronic substrates;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15
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