RDL-first Flexible FOWLP Technology with Dielets Embedded in Hydrogel
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159422.pdf?arnumber=9159422
Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. FOWLP-based Flexible Hybrid Electronics I: Photobiomodulation Device Fabrication on Hydrogel Substrate Using RDL-first Approach;2023 IEEE CPMT Symposium Japan (ICSJ);2023-11-15
2. 3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Assembly-based Through-X Via (TXV) Integration Technology by Advanced Fan-Out Wafer-Level Packaging;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
4. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
5. Fan-Out Wafer/Panel-Level Packaging;Semiconductor Advanced Packaging;2021
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