Author:
Liu Pan,Li Jian,Zeijl Henk van,Zhang Guoqi
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. Thermo-mechanical Analysis of Thermal Compression Bonding Chip-Join Process;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
3. Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06
4. System-in-Package (SiP);Semiconductor Advanced Packaging;2021