Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding-Reference-Cited by-同舟云学术

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Demonstration of Superconducting Interconnects on the Silicon Interconnect Fabric Using Thermocompression Bonding

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Yang Yu-Tao,Hu Chaowei,Green Jazmine,Zhang Peng,Shakoorzadeh Niloofar,Ambhore Pranav,Mogera Umesha,Ni Ni,Wang Kang L.,Iyer Subramanian S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159338.pdf?arnumber=9159338

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. RF Characterization on Nb-based Superconducting Silicon Interconnect Fabric for Future Large Scale Quantum Applications;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

2. Low Temperature Fine-pitch Cu-Cu Bonding Using Au Nanoparticles as Intermediate;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

3. Split-Fabric: A Novel Wafer-Scale Hardware Obfuscation Methodology using Silicon Interconnect Fabric;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

4. Wafer‐Scale Integration;Wiley Encyclopedia of Electrical and Electronics Engineering;2022-02-17

5. Large-Scale Quantum System Design on Nb-based Superconducting Silicon Interconnect Fabric;2021 22nd International Symposium on Quality Electronic Design (ISQED);2021-04-07

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