Author:
Teo Mary,Lee Ka Yau,Chew Alex,Lim Simon,Lee Charles,Nonomura Masaru
Cited by
3 articles.
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1. Surface Activation Beneath the Flip Chip by Plasma Treatments;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10
2. Long-tail Recognition via Compositional Knowledge Transfer;2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition (CVPR);2022-06
3. Enhanced polymeric encapsulation for MEMS based multi sensors for fisheries research;Sensors and Actuators A: Physical;2011-11