Affiliation:
1. Research and Development Team, StatsChipPAC Korea, Incheon, Republic of Korea
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Yield and reliability in flip chip underfill for optical modules
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4. Improvement of selective copper deposition by N2 plasma treatment;kwak;J Korean Phys Soc,2001
5. Effects of O2- and N2-Plasma Treatments on Copper Surface
Cited by
1 articles.
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