Three-dimensional MMIC technology for low-cost millimeter-wave MMICs-Reference-Cited by-同舟云学术

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Three-dimensional MMIC technology for low-cost millimeter-wave MMICs

Published:2001 Issue:9 Volume:36 Page:1351-1359
ISSN:0018-9200
Container-title:IEEE Journal of Solid-State Circuits
language:
Short-container-title:IEEE J. Solid-State Circuits

Author:

Nishikawa K.,Kamogawa K.,Piernas B.,Tokumitsu M.,Sugitani S.,Toyoda I.,Araki K.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx5/4/20432/00944662.pdf?arnumber=944662

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Measurement‐based analysis of GaAs HEMT technologies: Multilayer D‐H pseudomorphic HEMT versus conventional S‐H HEMT;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2021-02-18

2. Preliminary design of a dual 22/31 GHz single-chip water vapour radiometer;Ground-based and Airborne Telescopes VIII;2020-12-13

3. Uniformity investigation of pHEMTs in 3-D MMICs for pre and post multilayer fabrication;Solid-State Electronics;2020-02

4. Uniformity investigation of pHEMTs small-signal parameters for pre and post multilayer fabrication in 3D MMICs;Semiconductor Science and Technology;2019-11-29

5. 3-D multilayer monolithic integration of vertical-oriented double-heterojunction GaAs based pHEMT and thermal influence on device parameters;Solid-State Electronics;2017-06

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