Toward predictive modeling of full-size packages with layered-medium integral-equation methods-Reference-Cited by-同舟云学术

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Toward predictive modeling of full-size packages with layered-medium integral-equation methods

Published:2016-10 Issue: Volume: Page:
ISSN:
Container-title:2016 IEEE 25th Conference on Electrical Performance Of Electronic Packaging And Systems (EPEPS)
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Author:

Liu C.,Menshov A.,Subramanian V.,Aygun K.,Braunisch H.,Okhmatovski V. I.,Yilmaz A. E.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/7829213/7835401/07835446.pdf?arnumber=7835446

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Quantifying Uncertainties in the Correlation of Simulations and Measurements Using the IEEE EPS Packaging Benchmark Suite;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Efficient Boundary Element Methodology for Analyzing Interconnects in Multilayered PCBs;2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2023-10-15

3. A parallel FFT‐accelerated layered‐medium integral‐equation solver for electronic packages;International Journal of Numerical Modelling: Electronic Networks, Devices and Fields;2019-09-10

4. Surface-Volume-Surface Electric Field Integral Equation for Solution of Scattering Problems on 3-D Dielectric Objects in Multilayered Media;IEEE Transactions on Microwave Theory and Techniques;2018-12

5. A Nonradiating Finite-Gap Lumped-Port Model;IEEE Antennas and Wireless Propagation Letters;2018-07

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