A parallel FFT‐accelerated layered‐medium integral‐equation solver for electronic packages
Author:
Affiliation:
1. Department of Electrical and Computer EngineeringUniversity of Texas at Austin Austin Texas
2. Intel Corp Chandler Arizona
Funder
Intel Corporation
Publisher
Wiley
Subject
Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/jnm.2684
Reference50 articles.
1. LiuC MenshovA SubramanianV et al.Toward predictive modeling of full‐size packages with layered‐medium integral‐equation methods. In:Proc. IEEE 25th Conf. Elect. Perform. of Electron. Packag. Syst. (EPEPS) Oct.2016 pp.183–185.
2. ChewWC CangellarisAC Schutt‐AineJ et al.Fast and accurate multiscale electromagnetic modeling framework: an overview. In:Proc. 17th IEEE W. Signal Power Int. (SPI) May 2013.
3. LiuC AygunK BraunischH OkhmatovskiVI YilmazAE.A parallel iterative layered‐medium integral‐equation solver for electromagnetic analysis of electronic packages. In:Proc. IEEE 26th Conf. Elect. Perform. of Electron. Packag. Syst. (EPEPS) Oct. 2017.
4. Fast ${\cal H}$-Matrix-Based Direct Integral Equation Solver With Reduced Computational Cost for Large-Scale Interconnect Extraction
5. Equivalent Surface Impedance-Based Mixed Potential Integral Equation Accelerated by Optimized $\cal {H}$ -Matrix for 3-D Interconnects
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