Thermal characterization of TSV based 3D stacked ICs-Reference-Cited by-同舟云学术

登录注册会员服务联系我们

Thermal characterization of TSV based 3D stacked ICs

Published:2012-10 Issue: Volume: Page:
ISSN:
Container-title:2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems
language:
Short-container-title:

Author:

Swarup Sahana,Tan Sheldon X.-D.,Liu Zao

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/6424014/6457827/06457910.pdf?arnumber=6457910

Cited by 6 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Thermal Modeling and Analysis of 3D ICS with Heat Dissipation Effect of Power Distribution Networks;Journal of Circuits, Systems and Computers;2024-07-20

2. A junction temperature prediction model for 3D stacked packaging chip based on thermal resistance matrix;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-01

4. Quasi-3D Thermal Simulation of Integrated Circuit Systems in Packages;Energies;2020-06-12

5. Extending BookSim2.0 and HotSpot6.0 for power, performance and thermal evaluation of 3D NoC architectures;Simulation Modelling Practice and Theory;2019-11

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370

www.globalauthorid.com

TOP