Component Attachment to Inkjet Additive Printed Circuits to Achieve Flexible Signal Filters using Silver and Copper Nanoparticle Metal Inks-Reference-Cited by-同舟云学术

Component Attachment to Inkjet Additive Printed Circuits to Achieve Flexible Signal Filters using Silver and Copper Nanoparticle Metal Inks

Published:2022-05-31 Issue: Volume: Page:
ISSN:
Container-title:2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)
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Author:

Lall Pradeep¹,Goyal Kartik¹,Miller Scott²

Affiliation:

1. Auburn University,NSF-CAVE3 Electronics Research Center,Department of Mechanical Engineering,Auburn,USA,AL 36849

2. NextFlex National Manufacturing Institute,San Jose,USA,CA 95131

Funder

Manufacturing Institute

Air Force Research Laboratory

Publisher

IEEE

Link

Reference19 articles.

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4. Demonstration of Functional Circuits with Surface Mount Devices on Sustainable Water-Based Inkjet Printed Metallization;2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm);2023-05-30