Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents
Author:
Affiliation:
1. Key Laboratory of Smart Grid of Education Ministry, School of Electrical and Information Engineering, Tianjin University, Tianjin, China
2. Shandong Taikai Electrical Insulation Company Ltd, Tai’an, China
Funder
Science and Technology Major Project of Tai’an City
China Postdoctoral Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/94/10026623/09964133.pdf?arnumber=9964133
Reference36 articles.
1. Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin
2. Thermal-elastic free energy driven electrical tree breakdown process in epoxy resin under temperature gradient
3. The influence of tertiary amine accelerators on the curing behaviors of epoxy/anhydride systems
4. Influence of addition of hydroxyl-terminated liquid nitrile rubber on dielectric properties and relaxation behavior of epoxy resin
5. Triphenylphosphine‐containing microcapsules fabricated from Pickering emulsions as a thermal latent curing accelerator for an epoxy/anhydride system
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