Characterization of Electrical Tree Degradation of Epoxy Resin under Thermal and Temperature Stresses by Photoelastic Effect-Reference-Cited by-同舟云学术

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Characterization of Electrical Tree Degradation of Epoxy Resin under Thermal and Temperature Stresses by Photoelastic Effect

Published:2024-03 Issue:1 Volume:10 Page:12-20
ISSN:2096-1529
Container-title:Chinese Journal of Electrical Engineering
language:
Short-container-title:Chin. J. Electr. Eng.

Author:

Aung Hein Htet¹,Wang Yuhuai¹,Li Jin¹,Zhang Ying²,Takada Tatsuo³

Affiliation:

1. School of Electrical and Information Engineering, Tianjin University,Tianjin,China,300072

2. Baoding Technical College of Electric Power,Department of Power Generation and Transformation Engineering,Baoding,China,071051

3. Tokyo City University,Measurement and Electric Machine Control Laboratory,Tokyo,Japan,158-8557

Funder

National Natural Science Foundation of China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/7873788/10490165/10490171.pdf?arnumber=10490171

Reference27 articles.

1. Curing Regime-Modulating Insulation Performance of Anhydride-Cured Epoxy Resin: A Review

2. Curing Kinetics and Dielectric Properties of Anhydride Cured Epoxy Resin With Different Accelerator Contents

3. Curing Degree Dependence of Dielectric Properties of Bisphenol-A-Based Epoxy Resin Cured With Methyl Hexahydrophthalic Anhydride

4. Transport Characteristics of Interfacial Charge in SiC Semiconductor–Epoxy Resin Packaging Materials

5. Space charge dynamics in epoxy resin under voltage polarity reversal at various temperatures

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