Curing Degree Dependence of Dielectric Properties of Bisphenol-A-Based Epoxy Resin Cured With Methyl Hexahydrophthalic Anhydride
Author:
Affiliation:
1. Key Laboratory of Smart Grid of Education Ministry, School of Electrical and Information Engineering, Tianjin University, Tianjin, China
Funder
National Natural Science Foundation of China
China Postdoctoral Science Foundation
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/94/9999164/09913932.pdf?arnumber=9913932
Reference25 articles.
1. Free volume evolution in the process of epoxy curing and its effect on mechanical properties
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3. A Molecular Dynamics Study of Epoxy-Based Networks: Cross-Linking Procedure and Prediction of Molecular and Material Properties
4. A study of thermo-mechanical properties of the cross-linked epoxy: An atomistic simulation
5. The effect of curing conditions on the electrical properties of an epoxy resin
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