Impact of Added Gallium and Phosphorus in Bismuth-Tin Solder Alloys on Mechanical Properties and Microstructure of Intermetallic Layer
Author:
Affiliation:
1. Czech Technical University in Prague,Faculty of Electrical Engineering,Department of Electrotechnology,Prague,Czech Republic
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9812704/9812706/09812758.pdf?arnumber=9812758
Reference15 articles.
1. Effects of a Third Element on Microstructure and Mechanical Properties of Eutectic Sn-Bi Solder
2. Influence of Added Phosphorus and Gallium in Lead-free Bismuth-Tin Alloys on Wetting and Intermetallic Compounds
3. Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin
4. Comparison of mechanical resistance of SnCu and SnBi of solder joints;dušek;2017 40th International Spring Seminar on Electronics Technology (ISSE),2017
5. Effects of surface finishes on the intermetallic growth and micro-structure evolution of the Sn3.5Ag0.7Cu lead-free solder joints
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