Additive Manufacturing of 3D Circuit Carriers with Improved Thermal Conductivity

Author:

Utsch Daniel1,Piechulek Niklas1,Franke Joerg1

Affiliation:

1. Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen-Nürnberg,Bavaria,Germany

Funder

Bundesministerium für Bildung und Forschung

Publisher

IEEE

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Additively Printed Heating Structure for Radome De-icing Application;2024 47th International Spring Seminar on Electronics Technology (ISSE);2024-05-15

2. Polymeric composites in extrusion‐based additive manufacturing: a systematic review;Polymer Composites;2024-02-29

3. Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics;2023 46th International Spring Seminar on Electronics Technology (ISSE);2023-05-10

4. High Frequency Impedance of 3D Printed Electric Circuit Models;2022 14th Electrical Engineering Faculty Conference (BulEF);2022-09-14

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