Optimizing Adhesion of Printed Conductive Lines on Additively Manufactured Ceramics
Author:
Affiliation:
1. Institute for Factory Automation and Production Systems, Friedrich-Alexander-Universität Erlangen-Nürnberg,Bavaria,Germany
Funder
Bundesministerium für Bildung und Forschung
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10168303/10168312/10168526.pdf?arnumber=10168526
Reference18 articles.
1. Production of Miniaturizied Sensor Structures on Polymer Substrates using Inkjet Printing;kravchuk;Advanced Materials Research,2014
2. Generation of Printed Electronics on Thermal Sensitive Substrates by Laser Assisted Sintering of Nanoparticle Inks;mayer;2021 14th International Congress Molded Interconnect Devices (MID),2021
3. Printed electronics for extreme high temperature environments
4. Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates;roudenko;Molded Interconnect Devices (MID) 2018 13th International Congress,2018
5. Inkjet printing and adhesion characterisation of conductive tracks on a commercial printed circuit board material
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1. Reliability of Piezojet-Printed Conductive Lines on Alumina Substrates Produced by Fused Filament Fabrication;2023 15th International Congress Mechatronic Integration Discourse (MID);2023-06-21
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