System technology co-optimization and design challenges for 3D IC
Author:
Affiliation:
1. Arm Inc.,USA
2. Arm Ltd.,UK
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9772767/9772730/09772831.pdf?arnumber=9772831
Reference21 articles.
1. A high-density logic-on-logic 3DIC design using face-to-face hybrid wafer-bonding on 12nm FinFET process
2. Three-dimensional integration of nanotechnologies for computing and data storage on a single chip
3. A 7 nm 4GHz Arm®-core-based CoWoS® Chiplet Design for High Performance Computing;lin;VLSI circuits,2019
4. Power Delivery and Thermal-Aware Arm-Based Multi-Tier 3D Architecture
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